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	<pubDate>Mon, 25 Jul 2011 22:18:16 +0000</pubDate>
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		<title>Innovalight Acquired by DuPont for PV Play</title>
		<link>http://www.betasights.net/wordpress/?p=1303</link>
		<comments>http://www.betasights.net/wordpress/?p=1303#comments</comments>
		<pubDate>Mon, 25 Jul 2011 22:18:16 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
		<category><![CDATA[Material]]></category>

		<category><![CDATA[PV]]></category>

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		<category><![CDATA[efficiency]]></category>

		<category><![CDATA[HVM]]></category>

		<category><![CDATA[ink]]></category>

		<category><![CDATA[Innovalight]]></category>

		<category><![CDATA[integration]]></category>

		<category><![CDATA[JA Solar]]></category>

		<category><![CDATA[materials]]></category>

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		<guid isPermaLink="false">http://www.betasights.net/wordpress/?p=1303</guid>
		<description><![CDATA[Innovalight specialty PV materials company gets acquired by DuPont after successful integration of its silicon-ink screen-printed selective emitter (SE) into mulitple customer crystalline-silicon production lines.]]></description>
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		<title>Fraunhofer Quantifies Steam Purity PV Benefit</title>
		<link>http://www.betasights.net/wordpress/?p=1297</link>
		<comments>http://www.betasights.net/wordpress/?p=1297#comments</comments>
		<pubDate>Thu, 16 Jun 2011 05:34:52 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
		<category><![CDATA[Equipment]]></category>

		<category><![CDATA[FPD]]></category>

		<category><![CDATA[IC]]></category>

		<category><![CDATA[MEMS]]></category>

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		<category><![CDATA[OEM]]></category>

		<category><![CDATA[RASIRC]]></category>

		<category><![CDATA[steam]]></category>

		<category><![CDATA[vapor]]></category>

		<category><![CDATA[water]]></category>

		<guid isPermaLink="false">http://www.betasights.net/wordpress/?p=1297</guid>
		<description><![CDATA[Ultra-pure steam can improve the ultimate efficiency of PV cells by removing contaminants, as quantified by Fraunhofer ISE using Rasirc Steamer sub-systems.]]></description>
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		<title>JSAP 2011 Takuma Award to Masato Shibuya</title>
		<link>http://www.betasights.net/wordpress/?p=1288</link>
		<comments>http://www.betasights.net/wordpress/?p=1288#comments</comments>
		<pubDate>Wed, 06 Apr 2011 02:19:16 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
		<category><![CDATA[Equipment]]></category>

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		<category><![CDATA[Advanced Lithography]]></category>

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		<guid isPermaLink="false">http://www.betasights.net/wordpress/?p=1288</guid>
		<description><![CDATA[Prof. Masato Shibuya was awarded the JSAP Takuma Award 2011 for invention of the phase-shift mask (PSM) and opening the field of advanced lithography, as reported by independent PSM inventor Marc Levenson.]]></description>
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		<title>Advanced Lithography is All about Materials</title>
		<link>http://www.betasights.net/wordpress/?p=1273</link>
		<comments>http://www.betasights.net/wordpress/?p=1273#comments</comments>
		<pubDate>Mon, 21 Mar 2011 22:27:52 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
		<category><![CDATA[Equipment]]></category>

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		<category><![CDATA[Xtreme]]></category>

		<guid isPermaLink="false">http://www.betasights.net/wordpress/?p=1273</guid>
		<description><![CDATA[SPIE Advanced Lithography 2011 showed few new tools or techniques, but many new materials and integration tricks to extend 193i into double-patterning for IC HVM, while EUV and DSA developments continue according to expert Dr. M. David Levenson of BetaSights.]]></description>
		<wfw:commentRss>http://www.betasights.net/wordpress/?feed=rss2&amp;p=1273</wfw:commentRss>
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		<title>HB-LED mask aligner for HVM</title>
		<link>http://www.betasights.net/wordpress/?p=1250</link>
		<comments>http://www.betasights.net/wordpress/?p=1250#comments</comments>
		<pubDate>Sat, 26 Feb 2011 01:44:34 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
		<category><![CDATA[Equipment]]></category>

		<category><![CDATA[IC]]></category>

		<category><![CDATA[MEMS]]></category>

		<category><![CDATA[Product]]></category>

		<category><![CDATA[fab]]></category>

		<guid isPermaLink="false">http://www.betasights.net/wordpress/?p=1250</guid>
		<description><![CDATA[EV Group upgrades aligner platform with optics for transparent wafers like sapphire to create 200wph proximity aligner for high-brightness LED (HB-LED) high-volume manufacturing (HVM): EVG620HBL]]></description>
		<wfw:commentRss>http://www.betasights.net/wordpress/?feed=rss2&amp;p=1250</wfw:commentRss>
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		<title>NAND Flash and DRAM evolutions</title>
		<link>http://www.betasights.net/wordpress/?p=1238</link>
		<comments>http://www.betasights.net/wordpress/?p=1238#comments</comments>
		<pubDate>Fri, 07 Jan 2011 22:40:25 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
		<category><![CDATA[Equipment]]></category>

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		<category><![CDATA[12nm]]></category>

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		<category><![CDATA[Flash]]></category>

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		<category><![CDATA[IEDM]]></category>

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		<category><![CDATA[NAND]]></category>

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		<category><![CDATA[W]]></category>

		<guid isPermaLink="false">http://www.betasights.net/wordpress/?p=1238</guid>
		<description><![CDATA[IEDM 2010 showed evolutions of NAND Flash with ALD IPD and ECC to 1Xnm node processing, and embedded-DRAM (eDRAM) capacitor stacks in porous low-k, meaning mainstream memory technologies will continue to dominate commercial volumes.]]></description>
		<wfw:commentRss>http://www.betasights.net/wordpress/?feed=rss2&amp;p=1238</wfw:commentRss>
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		<title>Graphene devices and processing shown at IEDM</title>
		<link>http://www.betasights.net/wordpress/?p=1226</link>
		<comments>http://www.betasights.net/wordpress/?p=1226#comments</comments>
		<pubDate>Tue, 21 Dec 2010 23:38:38 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
		<category><![CDATA[Equipment]]></category>

		<category><![CDATA[IC]]></category>

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		<category><![CDATA[fab]]></category>

		<category><![CDATA[analog]]></category>

		<category><![CDATA[analogue]]></category>

		<category><![CDATA[backgate]]></category>

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		<category><![CDATA[gate]]></category>

		<category><![CDATA[GeorgiaTech]]></category>

		<category><![CDATA[GFET]]></category>

		<category><![CDATA[graphene]]></category>

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		<category><![CDATA[HK]]></category>

		<category><![CDATA[IBM]]></category>

		<category><![CDATA[IEDM]]></category>

		<category><![CDATA[MIT]]></category>

		<category><![CDATA[mixed-signal]]></category>

		<category><![CDATA[mobility]]></category>

		<category><![CDATA[RF]]></category>

		<category><![CDATA[SAIT]]></category>

		<category><![CDATA[SiC]]></category>

		<category><![CDATA[THz]]></category>

		<guid isPermaLink="false">http://www.betasights.net/wordpress/?p=1226</guid>
		<description><![CDATA[Graphene—the 2D hexagonal lattice of carbon—has been under investigation as a new material for electronics applications due to it&#8217;s high mobility and other unique properties. At IEDM this year, an entire session (#23) was devoted to showcasing graphene devices, and to sharing the latest processing tricks to grow and (sometimes) transfer the single-atomic-layer of carbon [...]]]></description>
		<wfw:commentRss>http://www.betasights.net/wordpress/?feed=rss2&amp;p=1226</wfw:commentRss>
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		<title>TSV interposers by IBM/Semtech for ADC/DSP</title>
		<link>http://www.betasights.net/wordpress/?p=1216</link>
		<comments>http://www.betasights.net/wordpress/?p=1216#comments</comments>
		<pubDate>Wed, 15 Dec 2010 02:39:31 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
		<category><![CDATA[IC]]></category>

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		<category><![CDATA[65nm]]></category>

		<category><![CDATA[90nm]]></category>

		<category><![CDATA[ADC/DSP]]></category>

		<category><![CDATA[CEA-Leti]]></category>

		<category><![CDATA[Cu]]></category>

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		<category><![CDATA[interposer]]></category>

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		<guid isPermaLink="false">http://www.betasights.net/wordpress/?p=1216</guid>
		<description><![CDATA[Through-silicon vias (TSV) by IBM and Semtech for ADC/DSP solutions use copper and deep-trench capacitors for RF applications; IEDM 2010 papers show TSV in active chips progressing slowly.]]></description>
		<wfw:commentRss>http://www.betasights.net/wordpress/?feed=rss2&amp;p=1216</wfw:commentRss>
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		<title>Applied Materials launches new HVM etch platform</title>
		<link>http://www.betasights.net/wordpress/?p=1208</link>
		<comments>http://www.betasights.net/wordpress/?p=1208#comments</comments>
		<pubDate>Mon, 29 Nov 2010 23:24:09 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
		<category><![CDATA[Equipment]]></category>

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		<category><![CDATA[Centris]]></category>

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		<category><![CDATA[uniformity]]></category>

		<guid isPermaLink="false">http://www.betasights.net/wordpress/?p=1208</guid>
		<description><![CDATA[Applied Materials lauches Centris platform for AdvantEdge MESA etch chambers, claiming 180 wph throughput, 0.8nm CD, and 30% lower CoO. Also releases new ultra HDP Silvia etch chamber for Centura, claiming $10 per wafer TSV etch.]]></description>
		<wfw:commentRss>http://www.betasights.net/wordpress/?feed=rss2&amp;p=1208</wfw:commentRss>
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		<title>Qcept may help GloFo vs. TSMC</title>
		<link>http://www.betasights.net/wordpress/?p=1199</link>
		<comments>http://www.betasights.net/wordpress/?p=1199#comments</comments>
		<pubDate>Sat, 27 Nov 2010 05:40:13 +0000</pubDate>
		<dc:creator>edkorczynski</dc:creator>
		
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		<category><![CDATA[IEEE]]></category>

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		<description><![CDATA[Qcept Technologies' ChemitriQ5000 may help GlobalFoundries vs. TSMC in gate-first HKMG integration for 32nm foundry customers with fab metrology for control of yield excursions]]></description>
		<wfw:commentRss>http://www.betasights.net/wordpress/?feed=rss2&amp;p=1199</wfw:commentRss>
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