Archive for February, 2009

Wednesday, February 11th, 2009

At Levitronix’s Ultrapure Fluid Handling and Wafer Cleaning Conference on February 11th, Particle Measuring Systems reviewed the limits of being able to detect things we do not want to find in flowing fluids, as enabled by a new digital detector array they call NanoVision Technology. Steven Verhaverbeke, tool design expert for Applied Materials who presented […]

Tuesday, February 10th, 2009

CMP applications experts gathered in Santa Clara, California on February 10th to share their experience and expertise at the fifth annual seminar sponsored by Levitronix. Leading developers, manufacturers, and end-users of CMP discussed all aspects of the technology, and since Levitronix makes magnetic levitation (MagLev) pumps there were many thorough presentations on slurry distribution issues. […]

Monday, February 9th, 2009

Toshiba claims the prototype of a new Ferroelectric Random Access Memory (FRAM) cell sized at 15F2 acheives read and write speed of 1.6-GB/s using a 130nm node CMOS process. The company will show details of this high bandwidth 128Mb non-volative RAM technology at the International Solid-State Circuits Conference 2009 (ISSCC 2009; Session 27.5) in San […]

Friday, February 6th, 2009

The SEMI PV Group today announced the release of its Global Photovoltaic (PV) Standards Roadmap Guidance Document, which identifies immediate opportunities for reducing cost and accelerating innovation in thin-film and crystalline silicon cell and module manufacturing through industry standards. This new roadmap confirms that major manufacturing cost savings are possible through standardizing wafer carriers and […]

Thursday, February 5th, 2009

Microbridge Technologies, the inventor of passive, analog, MEMS-based precision IC calibration products known as rejustors, announced it has successfully closed an internal round of funding to build out a new presssure sensor family of chips. “The company will launch a line of Micro-Flow pressure sensors that achieve new levels of performance for a wide range […]

Wednesday, February 4th, 2009

Allvia, the first through-silicon via (TSV) foundry, has secured $5 million from private investors in a round of funding to expand manufacturing facilities and to build more capacity. After 3 years of revenue generation from providing vertical interconnects and System-in-Package (SiP) solutions, total investment in the company is now $25 million. With in-house processing equipment, […]

Tuesday, February 3rd, 2009

The Collaborative Alliance for Semiconductor Test (CAST) will join SEMI as a special interest group to better manage and accelerate industry progress on critical test issues. CAST expects to gain administrative efficiencies, global resources, SEMI International Standards support, and greater recognition for the CAST agenda. CAST will transfer its governance structure and agenda to SEMI […]

Monday, February 2nd, 2009

Veeco has exited betas with a new Atomic Force Microscope (AFM) named Dimension® Icon™ that provides small-sample resolution for large-samples. Building upon the successful Dimension AFM platform, the latest member of the product line delivers the highest resolution, best ease-of-use, and fastest time-to-results of any large-sample AFM on the market today. “With the Icon AFM, […]