Posts Tagged ‘Si’

Tuesday, December 14th, 2010

Through-silicon vias (TSV) by IBM and Semtech for ADC/DSP solutions use copper and deep-trench capacitors for RF applications; IEDM 2010 papers show TSV in active chips progressing slowly.

Monday, November 8th, 2010

Xilinx 28nm FPGA Virtex-7 uses TSMC 65nm multi-level-metal (MLM) and through-silicon-via (TSV) Si-interposer for 2M gate and ARM-core integration product family.

Thursday, April 23rd, 2009

Silicon Valley has certainly not been immune to the current economic conditions, with many companies announcing multiple rounds of layoffs and moving operations overseas. Yet for many it is still considered “the heart” of the high-tech industry. At today’s well-attended Silicon Valley Lunch Forum, organized by the Sales and Marketing Council of SEMI, three speakers […]

Monday, April 20th, 2009

The Materials Research Society (MRS) Spring Meeting in San Francisco is so huge, this year attracting a record of over 5,000 attendees, that strategy is needed to try to see any representative sample of the event. To provide in-depth information about new materials technologies, new symposia have been added over the years such that there […]

Wednesday, April 15th, 2009

The first example of all-optical signal processing for communication above 100Gbit/s using silicon-based devices has been published in the April issue of Nature Photonics. Using deep-ultraviolet lithography, standard CMOS processing and organic molecular beam deposition, researchers from the University of Karlsruhe, IMEC and its associated laboratory INTEC at Ghent University, Lehigh University and ETH Zurich […]

Tuesday, April 14th, 2009

sp3 Diamond Technologies – the supplier of diamond film products, equipment, and services – today announced it is taking orders for 50mm and 100mm silicon on diamond (SOD) wafers for use as Gallium Nitride (GaN) substrates. Having worked with Nitronix on the GaN, sp3 Diamond Technologies uses combinations of thin-film depositions, wafer thinning, and layer […]

Monday, April 13th, 2009

Intermolecular, the combinatorial R&D company that has been working on semiconductor fab processes, plans to grow solar R&D to possibly be the largest portion of the company’s business. Under the leadership of new vice president and general manager of solar business group Craig Hunter (who joined from Applied Materials), Intermolecular is now working on both […]

Friday, April 10th, 2009

The Materials Research Society (MRS) Bulletin for April 2009 covers some of the newest engineering work for the growth of large and pure electronic crystals. In this week before the annual MRS Spring Meeting in San Francisco, this issue of the monthly MRS members magazine provides an excellent overview of the latest technologies used to […]

Wednesday, April 8th, 2009

IMEC has begun expanding its beautiful Leuven, Belgium campus facilities, starting with 2,800 square-meters of research labs and including the extension of its state-of-the-art clean room. With this extension, IMEC will expand its research on 22nm CMOS and beyond, low-cost and high-efficiency solar cells, and biomedical electronics. The Flemish Government invests 35 million euro and […]

Tuesday, April 7th, 2009

Semiconductor Equipment and Materials International (SEMI) collects and reports market size information for key sectors of the semiconductor ecosystem. It recently issued figures for the materials market, which in 2008 totaled $42.7 billion, essentially flat with the prior year. According to SEMI, rapidly slowing economic conditions in the fourth quarter squelched prospects for year-over-year growth […]