Archive for January, 2009

Friday, January 30th, 2009

Ziptronix wants to help you with your 3D roadmap. The IP spin-out from Research Triangle Park, NC is now actively negotiating licenses to its unique wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding technologies. Using treated-oxide (with surface treatments) and nickel (with a mystery metal) as the connecting materials, room temperature bonding with up to 108/cm2 of […]

Thursday, January 29th, 2009

Aixtron and Ovonyx announced a JDP for Atomic Vapor Deposition (AVD®) process technology to push scaling of next-generation phase change memory (PCM) products. Since it is expected to replace current high-density memory, PCM cells must be made dense and so companies like Samsung (Ref: BetaSights Newsletter 0001) and Numonyx require CVD-like processes for gap-fill instead […]

Wednesday, January 28th, 2009

Silicon Clocks, the developer of custom semiconductor timing solutions that has reinvented itself as a “custom product development house” with a new CEO, has announced a new product based on its CMOS-MEMS (CMEMS) embedded approach. CMEMS-ZeroThermal passive temperature compensation resonators exhibit comparable temperature stability to quartz crystals, while drastically simplifying oscillator design, and reportedly reducing […]

Tuesday, January 27th, 2009

After the 1st “act” of the story of Intel as a memory chip company founded in 1969, the 2nd act really started in 1985 with the decision to bet the company on the 80386 microprocessor according to Richard S. Tedlow, Harvard Business School professor and residential scholar of the Computer History Museum, in a lecture […]

Monday, January 26th, 2009

CEA/Leti, along with e-beam lithography supplier Vistec, and new design and software company D2S, recently announced a collaboration focused on refining and validating advanced design-for-e-beam (DFEB) solutions for 45nm and 32nm nodes. Over the next 12 months, Leti will manufacture test chips using a combination of D2S’ design and software capabilities along with the latest […]

Friday, January 23rd, 2009

Researchers from Sungkyunkwan University (SKKU) in Korea have found that large graphene films can be formed using CVD over a Ni thin film. The graphene is both strong and stretchy, and at low temperatures the monolayers transferred to SiO2 substrates show electron mobility >3,700 cm2/Vs implying that the quality is as high as mechanically-cleaved graphene. […]

Thursday, January 22nd, 2009

At SEMICON Korea 2009, SUSS MicroTec unveiled the second generation of its ACS300, a modular system for coating, baking and developing of wafers up to 300mm. Compared to the prior generation, the Gen2 tool reportedly costs less, has reduced footprint, and offers configuration flexibility with new capabilities. The system architecture and process modules are specifically […]

Wednesday, January 21st, 2009

The first customer for an Applied Materials (AMAT) turnkey SunFab thin-film PV fab—Moser Baer in Greater Noida, India—announced today that the 40 MW capacity line has passed final acceptance test (FAT) certification after having met all manufacturing, module efficiency, and yield specifications. PV modules from the line have been certified by the International Electrotechnical Commission […]

Tuesday, January 20th, 2009

Just over five years ago, I was one of the steering committee members of the MIT • Stanford • UC Berkeley Nanotechnology Forum, and had the pleasure of meeting new U.S. Energy Secretary Steven Chu when he was one of the presenters at our first event, “Nanotech beyond the hype,” held May 29, 2003 at […]

Monday, January 19th, 2009

There is no BetaBlog posting today, in observance of Dr. Martin Luther King, Jr.’s birthday. “You don’t need to know the second theory of thermodynamics in physics to serve…” – from Dr. Martin Luther King’s speech The Drum Major Instinct delivered at Ebenezer Baptist Church, Atlanta, Georgia, on 4 February 1968. While on summer break […]