Posts Tagged ‘IP’

Friday, February 13th, 2009

Evident Technologies has announced the issuance of US Patent No. 7,482,059 covering the ability to synthesize a quantum dot with a metal layer which dramatically enhances the brightness and stability of a semiconductor nanocrystal complex. This advance of semiconductor materials science relies on a relatively low-cost colloidal formation processing, instead of needing epitaxial lattice-matching or […]

Friday, January 30th, 2009

Ziptronix wants to help you with your 3D roadmap. The IP spin-out from Research Triangle Park, NC is now actively negotiating licenses to its unique wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding technologies. Using treated-oxide (with surface treatments) and nickel (with a mystery metal) as the connecting materials, room temperature bonding with up to 108/cm2 of […]

Wednesday, January 28th, 2009

Silicon Clocks, the developer of custom semiconductor timing solutions that has reinvented itself as a “custom product development house” with a new CEO, has announced a new product based on its CMOS-MEMS (CMEMS) embedded approach. CMEMS-ZeroThermal passive temperature compensation resonators exhibit comparable temperature stability to quartz crystals, while drastically simplifying oscillator design, and reportedly reducing […]