Posts Tagged ‘CMOS’

Friday, November 26th, 2010

Qcept Technologies’ ChemitriQ5000 may help GlobalFoundries vs. TSMC in gate-first HKMG integration for 32nm foundry customers with fab metrology for control of yield excursions

Monday, October 18th, 2010

IEDM 2010 best hints at 22nm node fab tech alternate-channel materials, dual- and tri-gate transistors, and RF, MEMS, lab-on-chip, graphene, analog, memory ReRAM results.

Monday, July 19th, 2010

Soft plasmas for monolayer etching by Ed Korczynski at NCCAVS PAG meeting at SEMICON/West 2010, including TEL Tactras RLSA and AMAT AdvantEdge Mesa for HKMG 32nm, STI, and bWL etches.

Monday, March 22nd, 2010

The upcoming Spring Materials Research Society (MRS) Meeting in San Francisco will feature a separate “Nanocontact and Nanointerconnects Workshop” to explore the biggest secret about the smallest devices: for the near-term there’s nothing better than standard metal. The workshop will address both theoretical and experimental approaches to formation, carrier transport, and reliability, and so will […]

Thursday, April 23rd, 2009

Silicon Valley has certainly not been immune to the current economic conditions, with many companies announcing multiple rounds of layoffs and moving operations overseas. Yet for many it is still considered “the heart” of the high-tech industry. At today’s well-attended Silicon Valley Lunch Forum, organized by the Sales and Marketing Council of SEMI, three speakers […]

Monday, April 20th, 2009

The Materials Research Society (MRS) Spring Meeting in San Francisco is so huge, this year attracting a record of over 5,000 attendees, that strategy is needed to try to see any representative sample of the event. To provide in-depth information about new materials technologies, new symposia have been added over the years such that there […]

Wednesday, April 15th, 2009

The first example of all-optical signal processing for communication above 100Gbit/s using silicon-based devices has been published in the April issue of Nature Photonics. Using deep-ultraviolet lithography, standard CMOS processing and organic molecular beam deposition, researchers from the University of Karlsruhe, IMEC and its associated laboratory INTEC at Ghent University, Lehigh University and ETH Zurich […]

Wednesday, April 8th, 2009

IMEC has begun expanding its beautiful Leuven, Belgium campus facilities, starting with 2,800 square-meters of research labs and including the extension of its state-of-the-art clean room. With this extension, IMEC will expand its research on 22nm CMOS and beyond, low-cost and high-efficiency solar cells, and biomedical electronics. The Flemish Government invests 35 million euro and […]

Wednesday, March 25th, 2009

Novaled, the provider of Organic Light Emitting Diode (OLED) technology and materials, and Holst Centre, an independent R&D centre developing generic technologies for Wireless Autonomous Transducer Solutions and for Systems-in-Foil, have decided to collaborate on the development of organic thin film transistor (OTFT) technologies under a joint development agreement. Novaled will provide its organic dopants […]

Tuesday, March 3rd, 2009

IEDM 2008 included the unveiling of Schiltron’s (Session 34.6) revolutionary 3-D high density Flash technology that combines the smallest TFTs to date in series strings of up to 64 cells. The unique architecture effectively removes pass disturbs allowing large worst-case string currents and resulting in thinner tunnel oxides, lower erase voltages, and higher endurance than […]