Thursday, July 30th, 2009
				
					Evergreen Solar, the manufacturer of “String Ribbon” solar power products, announced it has finalized agreements with Jiawei Solarchina and the Wuhan government’s Hubei Science & Technology Investment Co., Ltd. (“HSTIC”) for the setup and operation of a new 100MW mc-Si panel fab. Factory construction has begun and the parties expect that wafer, cell, and panel […]
				 
				Wuhan provides US$33M for Evergreen/Jiawei 100MW PV line
Tags: fab, JV, mc-Si, PV, silicon, solar
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				Wednesday, July 22nd, 2009
				
					At SEMICON West and Intersolar North America last week in San Francisco, crossing guards danced to keep the throngs away from the vehicles at the corner of 4th and Howard, as many people flowed back and forth between the shows co-located across 4th Street from each other. SEMICON West, down ~30% in size from last […]
				 
				Intersolar and SEMICON in SF show fab tech marches on
Tags: 22nm, 32nm, IC, Material, OEM, PV, SEMI, Semiconductor
 Posted in Equipment, fab, IC, Material, MEMS, Product, PV, Service |   Comments Off on Intersolar and SEMICON in SF show fab tech marches on
			 
				
				Friday, July 10th, 2009
				
					Intersolar North America 2009, co-located with SEMICON West in San Francisco next week, will include a Solar Startups Forum on July 16 to showcase some new technologies that are now in beta tests in the field. Select companies will make in depth presentations and offer insight into the atmosphere and environment of the solar industry […]
				 
				Successful Solar Startups to be shown
Tags: beta, CdTe, CPV, fab, PV, test, TW
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				Tuesday, July 7th, 2009
				
					Applied Materials has extended physical vapor deposition (PVD) technology to be able to coat the sidewalls of 22nm node structures. “It’s been validated, it’s been shipped, and it’s been qualified in pilot lines for both logic and memory,” asserted Marek Radko, Applied Materials’ BEOL GPM Manager, in an exclusive interview with BetaSights. Separately, the company […]
				 
				New PVD for both nano and micro
Tags: 22nm, 32nm, barrier, barrier/seed, Cu, damascene, fab, IC, metal, PVD, seed, TSV, UBM
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