Archive for May, 2009

Friday, May 8th, 2009

Today, Intel sponsored a history of the planar IC event at the Computer History Museum, in Mountain View, California. This, in the same week that the company pre-launches a new advertising campaign to try to position the company as “Sponsors of Tomorrow.” Based on the live event, the past was seriously wonderful. Based on these […]

Friday, May 1st, 2009

Leaving California for the first time, the 12th annual IEEE International Interconnect Technology Conference (IITC) will take place in Sapporo, Japan, June 1-3. With lithographic shrinks in 2D dimensions slowing, interconnects between chips in packages and in 3D stacks will be the driver for increased density and functionality in ICs. Thus, the more than 80 […]