Posts Tagged ‘SoC’

Monday, November 8th, 2010

Xilinx 28nm FPGA Virtex-7 uses TSMC 65nm multi-level-metal (MLM) and through-silicon-via (TSV) Si-interposer for 2M gate and ARM-core integration product family.

Tuesday, January 27th, 2009

After the 1st “act” of the story of Intel as a memory chip company founded in 1969, the 2nd act really started in 1985 with the decision to bet the company on the 80386 microprocessor according to Richard S. Tedlow, Harvard Business School professor and residential scholar of the Computer History Museum, in a lecture […]

Monday, January 26th, 2009

CEA/Leti, along with e-beam lithography supplier Vistec, and new design and software company D2S, recently announced a collaboration focused on refining and validating advanced design-for-e-beam (DFEB) solutions for 45nm and 32nm nodes. Over the next 12 months, Leti will manufacture test chips using a combination of D2S’ design and software capabilities along with the latest […]

Tuesday, January 13th, 2009

At SEMI’s Industry Strategy Symposium (ISS) running at Half Moon Bay, California today, IMEC president and CEO Gilbert Declerck talked about the need for R&D to facilitate IC industry growth. An industry based on answering the question, “what have you done for me lately?” can never rest on past successes and must continue to innovate. […]