Microbridge Technologies, the inventor of passive, analog, MEMS-based precision IC calibration products known as rejustors, announced it has successfully closed an internal round of funding to build out a new presssure sensor family of chips. “The company will launch a line of Micro-Flow pressure sensors that achieve new levels of performance for a wide range […]
Allvia, the first through-silicon via (TSV) foundry, has secured $5 million from private investors in a round of funding to expand manufacturing facilities and to build more capacity. After 3 years of revenue generation from providing vertical interconnects and System-in-Package (SiP) solutions, total investment in the company is now $25 million. With in-house processing equipment, […]
The Collaborative Alliance for Semiconductor Test (CAST) will join SEMI as a special interest group to better manage and accelerate industry progress on critical test issues. CAST expects to gain administrative efficiencies, global resources, SEMI International Standards support, and greater recognition for the CAST agenda. CAST will transfer its governance structure and agenda to SEMI […]
Veeco has exited betas with a new Atomic Force Microscope (AFM) named Dimension® Icon™ that provides small-sample resolution for large-samples. Building upon the successful Dimension AFM platform, the latest member of the product line delivers the highest resolution, best ease-of-use, and fastest time-to-results of any large-sample AFM on the market today. “With the Icon AFM, […]
Ziptronix wants to help you with your 3D roadmap. The IP spin-out from Research Triangle Park, NC is now actively negotiating licenses to its unique wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding technologies. Using treated-oxide (with surface treatments) and nickel (with a mystery metal) as the connecting materials, room temperature bonding with up to 108/cm2 of […]
Aixtron and Ovonyx announced a JDP for Atomic Vapor Deposition (AVD®) process technology to push scaling of next-generation phase change memory (PCM) products. Since it is expected to replace current high-density memory, PCM cells must be made dense and so companies like Samsung (Ref: BetaSights Newsletter 0001) and Numonyx require CVD-like processes for gap-fill instead […]
Silicon Clocks, the developer of custom semiconductor timing solutions that has reinvented itself as a “custom product development house” with a new CEO, has announced a new product based on its CMOS-MEMS (CMEMS) embedded approach. CMEMS-ZeroThermal passive temperature compensation resonators exhibit comparable temperature stability to quartz crystals, while drastically simplifying oscillator design, and reportedly reducing […]
CEA/Leti, along with e-beam lithography supplier Vistec, and new design and software company D2S, recently announced a collaboration focused on refining and validating advanced design-for-e-beam (DFEB) solutions for 45nm and 32nm nodes. Over the next 12 months, Leti will manufacture test chips using a combination of D2S’ design and software capabilities along with the latest […]
Researchers from Sungkyunkwan University (SKKU) in Korea have found that large graphene films can be formed using CVD over a Ni thin film. The graphene is both strong and stretchy, and at low temperatures the monolayers transferred to SiO2 substrates show electron mobility >3,700 cm2/Vs implying that the quality is as high as mechanically-cleaved graphene. […]
At SEMICON Korea 2009, SUSS MicroTec unveiled the second generation of its ACS300, a modular system for coating, baking and developing of wafers up to 300mm. Compared to the prior generation, the Gen2 tool reportedly costs less, has reduced footprint, and offers configuration flexibility with new capabilities. The system architecture and process modules are specifically […]