Tuesday, October 5th, 2010
Direct-write, maskless, lithography using e-beams is not ready for 22nm node IC manufacturing, and the SPIE BACUS presentations show EbDW issues include data transfer and inspection.
Maskless lithography not ready for 22nm
Tags: 22nm, BACUS, DUV, EbDW, IC, litho, lithography, MAPPER, mask, R&D, REBL, SPIE
Posted in Equipment, fab, IC, Material, Product, Service | Comments Off on Maskless lithography not ready for 22nm
Tuesday, September 14th, 2010
E-beam Initiative adds four members and starts on Design for E-beam (DFEB) for mask makng for ICs to reduce mask costs at 22nm and below.
E-beam Initiative speeds mask making
Tags: 193i, 22nm, 32nm, BACUS, CDU, D2S, DFM, e-Beam Initiative, EbDW, IC, Intel, litho, mask, node, SPIE, SRAF
Posted in Equipment, fab, IC, Material, Product, Service | Comments Off on E-beam Initiative speeds mask making
