Stangl Semiconductor Equipment has launched its Linea horizontal inline wet process platform for cleaning and etching of crystalline silicon PV wafers. The fully-automated dry-in/dry-out system offers reliable production capacity of up to 3,400 wafers per hour (wph) corresponding to an estimated 60 MW per line running 156mm wafers. The system can also be configured at […]

FSI International, Inc. (Nasdaq: FSII) announced December 23, 2008 that it has received an order for it’s new ORION® single wafer cleaning platform after a beta evaluation by a major semiconductor manufacturer. The tool will be used for resist strip in 32nm metal interconnect modules, using FSI’s proprietary “ViPR” extension of the classic “piranha” (a.k.a., […]