Wednesday, February 25th, 2009
Applied Materials’ Technical Symposium at SPIE 2009 featured a panel discussion on next generation lithography (NGL) that was moderated by the company’s Ken MacWIlliams. The outstanding panelists were C. Grant Willson (UT-Austin), Burn Lin (TSMC), Jongwook Kye (AMD), Steve Radigan (Sandisk), and Milind Weling (Cadence). As would be expected from this panel, EUV steppers were […]
IC next-generation litho needs all possible tricks
Tags: DP, EbDR, i193, litho, NIL, stepper
Posted in Equipment, fab, IC, Material, MEMS, Product, PV, Service | Comments Off on IC next-generation litho needs all possible tricks
Tuesday, February 24th, 2009
At the Nikon Lithovisions 2009 Symposium on February 22 this year in San Jose, California, Masato Hamatani described the features and beta test results for the NSR-S620 scanning immersion exposure tool, optimized for double patterning lithography. While the tool boasts only one wafer stage, its “Streamlign Platform” concept shoots 200 wafers per hour with 2nm […]
Nikon NSR-S620: Single Stage Double Patterning
Tags: beta, DP, i193, litho, stepper
Posted in Equipment, fab, IC, Product, Uncategorized | Comments Off on Nikon NSR-S620: Single Stage Double Patterning