Posts Tagged ‘cap’

Tuesday, March 17th, 2009

Breaking news about a leading porous low-k (PLK) material from Japan was first revealed in the SemiNeedle Planarization Lounge Forums (www.semineedle.com/forums/5001) about two months ago. During an expert panel discussion on CMP integration with low-k materials (moderated by this editor, summarized in ‚ÄúChemical-Mechanical Planarization (CMP) technology consensus 09Q1” publication available at the site), Dick James, […]