Monday, March 21st, 2011
SPIE Advanced Lithography 2011 showed few new tools or techniques, but many new materials and integration tricks to extend 193i into double-patterning for IC HVM, while EUV and DSA developments continue according to expert Dr. M. David Levenson of BetaSights.
Advanced Lithography is All about Materials
Tags: 10nm, 16nm, 193i, 20nm, 22nm, a-Si, Advanced Lithography, ALD, alt-PSM, ArF, ASML, CAR, CDU, Cymer, DFM, Dow, DP, DPP, DR, DSA, EbDW, EDA, EUV, EUVL, GDR, Gigaphoton, IBM, IC, IMEC, Intel, LELE, LER, Levenson, litho, logic, LPP, LWR, materials, MEEF, Nikon, OPC, PAG, RDR, RET, RSADP, SADP, Samsung, SPIE, SRAM, TEL, TSMC, Xtreme
Posted in Equipment, fab, IC, Material, MEMS, Product, Service | Comments Off on Advanced Lithography is All about Materials
Wednesday, July 21st, 2010
Applied Materials kills the turnkey SunFab thin-film a-Si/mc-Si PV line, after failing to keep up with CdTe and CIGS thin-film technologies in efficiency and cost, taking ~$400M loss.
AMAT finally kills SunFab line
Tags: a-Si, CdTe, CIGS, efficiency, fab, mc-Si, PV, thin-film
Posted in Equipment, fab, Product, PV, Service | Comments Off on AMAT finally kills SunFab line
Friday, November 13th, 2009
Intermolecular, the company that brought combinatorial chemistry to semiconductor manufacturing R&D, has expanded its focus to look at ways to improve basic manufacturing processes for photovoltaic (PV) fabs. “I think that the PV devices of 10 years from now will look significantly different from those of today,” said Intermolecular vice president and general manager of […]
Intermolecular’s PV R&D and Caltech/Dow’s PV plan
Tags: a-Si, CdTe, CIGS, mc-Si, PV, R&D, thin-film
Posted in Equipment, fab, FPD, Material, Product, PV, Service | Comments Off on Intermolecular’s PV R&D and Caltech/Dow’s PV plan
