Monday, March 21st, 2011
SPIE Advanced Lithography 2011 showed few new tools or techniques, but many new materials and integration tricks to extend 193i into double-patterning for IC HVM, while EUV and DSA developments continue according to expert Dr. M. David Levenson of BetaSights.
Advanced Lithography is All about Materials
Tags: 10nm, 16nm, 193i, 20nm, 22nm, a-Si, Advanced Lithography, ALD, alt-PSM, ArF, ASML, CAR, CDU, Cymer, DFM, Dow, DP, DPP, DR, DSA, EbDW, EDA, EUV, EUVL, GDR, Gigaphoton, IBM, IC, IMEC, Intel, LELE, LER, Levenson, litho, logic, LPP, LWR, materials, MEEF, Nikon, OPC, PAG, RDR, RET, RSADP, SADP, Samsung, SPIE, SRAM, TEL, TSMC, Xtreme
Posted in Equipment, fab, IC, Material, MEMS, Product, Service | Comments Off on Advanced Lithography is All about Materials
Saturday, February 20th, 2010
The SPIE’s 7th Frits Zernike Award for Advances in Optical Microlithography goes to M. David Levenson, BetaSights Litho & DFM Editor, in recognition of one of the most important developments in lithography resolution enhancement of the last twenty years, the phase shifting mask (PSM). About 30 years ago at the IBM San Jose Lab, Levenson […]
Leading through Darkness: M. David Levenson interviewed
Tags: EUV, IC, LELE, litho, R&D
Posted in Equipment, fab, IC, Material, MEMS | Comments Off on Leading through Darkness: M. David Levenson interviewed
