Archive for the ‘IC’ Category
Thursday, January 15th, 2009
As SEMI’s SMC today, Raymond Roberge, SVP and CTO of Praxair Electronics, proposed a pragmatic new collaboration model for electronic materials R&D. Semiconductor fab process materials TAM for 2008 was ~$10B, yet materials suppliers now question their ongoing profitability. “Certainly the 300mm shift has resulted in productivity advances for IDMs at the expense of materials […]
Praxair’s materials R&D collaboration model
Tags: 300mm, ALD, CMP, electronic, fab, IC, IDM, materials, OEM, R&D, SMC, supplier
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Wednesday, January 14th, 2009
Smart Equipment Technology (S.E.T.), a wholly-owned subsidiary of Replisaurus Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announced yesterday that it will collaborate with IMEC on 3DIC R&D. IMEC’s 3D integration program explores 3D technology and design for applications in various domains, focusing on 3D WLP […]
Replisaurus 3DIC R&D with IMEC
Tags: 3D, bonder, chip, ECPR, flip-chip, IC, integration, interconnect, JDP, stacked
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Tuesday, January 13th, 2009
At SEMI’s Industry Strategy Symposium (ISS) running at Half Moon Bay, California today, IMEC president and CEO Gilbert Declerck talked about the need for R&D to facilitate IC industry growth. An industry based on answering the question, “what have you done for me lately?” can never rest on past successes and must continue to innovate. […]
ISS growth theme set by IMEC
Tags: 32nm, 3D, ADT, CMOS, EUV, fab, IC, investment, lithography, MEMS, Moore, R&D, SoC
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Wednesday, January 7th, 2009
On January 6, 2009, ASM International and SAFC Hitech (a business segment within SAFC, a member of the Sigma-Aldrich Group) announced that they have entered into a certified manufacturer and partnership agreement for ALD precursors for barium- and strontium-based high-k insulators. The agreement includes certification criteria, a license to certain ASM ALD patents, and a […]
ASM and SAFC Hitech to work on Ba and Sr ALD
Tags: 32nm, ALD, CMOS, cyclopentadienyl, DRAM, high-k, HK, IC, MOCVD, precursor
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Tuesday, January 6th, 2009
The first issue of the BetaSights Newsletter has been published (see link to a free copy in the right-side column of this page under “Newsletters”), and a reader has already provided a correction. Michael Current (San Jose, California) noticed that the initial web-link to the slides from Prof. Asenov’s IEDM 2008 variability presentation was incorrect; […]
Very variable transistors
Tags: CMOS, IC, node, scaling, shrink, variability
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Monday, January 5th, 2009
FSI International, Inc. (Nasdaq: FSII) announced December 23, 2008 that it has received an order for it’s new ORION® single wafer cleaning platform after a beta evaluation by a major semiconductor manufacturer. The tool will be used for resist strip in 32nm metal interconnect modules, using FSI’s proprietary “ViPR” extension of the classic “piranha” (a.k.a., […]
FSI cleaning tool exits beta with payment
Tags: 32nm, beta, clean, interconnect, Semiconductor, single-wafer, SPM, ViPR
Posted in Equipment, fab, IC, Product | Comments Off on FSI cleaning tool exits beta with payment
Sunday, January 4th, 2009
This is the first example of a posting to BetaSights new BetaBlog. New posts will appear most working days, so bookmark this site and check back regularly. BetaSights was founded in the fall of 2008 by industry veterans Ed Korczynski and Elizabeth Schumann, to provide commercial free, member supported, productive info about fab beta sites. […]
Welcome to the beginning of BetaBlog(SM)
Tags: Equipment, fab, FPD, IC, materials, MEMS, PV, Service
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